- All sections
- C - Chemistry; metallurgy
- C25D - Processes for the electrolytic or electrophoretic production of coatings; electroforming; joining workpieces by electrolysis; apparatus therefor
- C25D 3/64 - Electroplating; Baths therefor from solutions of alloys containing more than 50% by weight of silver
Patent holdings for IPC class C25D 3/64
Total number of patents in this class: 77
10-year publication summary
6
|
7
|
1
|
7
|
4
|
3
|
11
|
8
|
3
|
3
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Umicore Galvanotechnik GmbH | 55 |
8 |
Rohm and Haas Electronic Materials LLC | 637 |
6 |
Dowa Metaltech Co., Ltd. | 150 |
5 |
JX Nippon Mining & Metals Corporation | 1576 |
4 |
MacDermid Enthone Inc. | 237 |
4 |
Mitsubishi Materials Corporation | 2378 |
4 |
BASF SE | 19740 |
3 |
Xtalic Corporation | 63 |
3 |
Robert Bosch GmbH | 40953 |
2 |
Tyco Electronics Corporation | 792 |
2 |
HARTING AG & Co. KG | 18 |
2 |
M-tech Japan Co., Ltd. | 3 |
2 |
MSP Co., Ltd. | 8 |
2 |
S&schem Co.,Ltd. | 2 |
2 |
Rtx Corporation | 8674 |
2 |
International Business Machines Corporation | 60644 |
1 |
Sumitomo Electric Industries, Ltd. | 14131 |
1 |
Yazaki Corporation | 6282 |
1 |
Sumitomo Wiring Systems, Ltd. | 9367 |
1 |
Dow Global Technologies LLC | 10147 |
1 |
Other owners | 21 |